ASAP Co., Ltd. (Saitama, Japan) manufactures photolithography process equipment for Si, compound semiconductor, and MEMS substrates in the 2"–8" diameter range.
Core product lines include spin coater/developer tracks (resist, polyimide, and dopant; low to >10,000 cP viscosity; cure temps >400°C), contact/proximity mask aligners, and lift-off process systems. Track configurations scale from R&D manual tools (~100 wafers/day) to dual-robot production systems (>1,000 wafers/day), with up to 7 process unit stages and 5-stage baking modules. Substrate bow tolerance to 200 μm. Full in-house design-to-manufacture with custom-order capability.
Product Literature
ASAP (Japan) Equipment Overview PDF
Overview of ASAP equipment, including coaters, mark aligners, developers, and lift-offs, with configuration examples and technical specs for coating and more.
ASAP (Japan) Product Information PDF
In-depth specs and details for ASAP products, including coating performance, exposure performance, process method comparisons, and more.